Evaluation of the amalgamation reaction of experimental Ag-Sn-Cu alloys containing Pd using a mercury plating technique.
نویسندگان
چکیده
A mercury plating technique was used to determine the phases forming on experimental Ag-Sn-Cu alloy powders (with and without Pd) exposed to electrolytically deposited mercury. Four series of alloy powders were made: a) 1.5% Pd with 10-14% Cu (CU series); b) 1.0% Pd with 10-14% Cu (1PD series); c) 1.5% Pd with different ratios of Ag3Sn (gamma) to Ag4Sn (beta) with 12% Cu (AGSN series); and d) 9-13% Cu with no Pd (NOPD series). Each powder was pressed on a freshly prepared amalgam specimen made from the same powder and metallographically polished until cross sections appeared; mercury was electroplated on the alloy particles. Alloy powders, amalgams and electroplated specimens were examined using XRD and SEM/EDS. XRD confirmed the presence of gamma2 in amalgams made from alloys with Cu < 13% or with Ag3Sn/Ag4Sn > 0.8. Specimens with moderately plated Hg showed gamma1 (Ag2Hg3) polyhedra and eta' Cu6Sn5, but not gamma2. This method effectively identifies alloys prone to forming gamma2.
منابع مشابه
Lead-Free Soldering – Where The World Is Going
Lead-free soldering for electronic industry is a segment of global trend toward lead-free environment. Although initiated in U.S. in early 1990’s, it advanced much more rapidly in Japan and Europe. This differentiation in Pb-free progress triggered great concerns of users of Pb-containing solders about maintaining business opportunity, therefore further expedites the advancement of Pb-free sold...
متن کاملEffects of Sn, Ga, and In additives on properties of Ag-Pd-Au-Cu alloy for ultra-low fusing ceramics.
Nine 35% Ag-30% Pd-20% Au-15% Cu alloys containing 2, 4 and 6 mass% of Sn, Ga or In as an additive metal were experimentally prepared to investigate the effects of different additives and their content on the physical and mechanical properties as well as the bond with a ultra-low fusing ceramic. Both the different additives and their content or either of these two factors significantly influenc...
متن کاملAdhesion of adhesive resin to dental precious metal alloys. Part I. New precious metal alloys with base metals for resin bonding.
New dental precious metal alloys for resin bonding without alloy surface modification were developed by adding base metals (In, Zn, or Sn). Before this, binary alloys of Au, Ag, Cu, or Pd containing In, Zn, or Sn were studied for water durability and bonding strength with 4-META resin. The adhesion ability of the binary alloys was improved by adding In equivalent to 15% of Au content, Zn equiva...
متن کاملEffect of Ni or Co Addition to Sn-Ag Solder on Microstructure and Joint Strength at Interface
Among various lead-free alloys, Sn-Ag(-Cu) system solders are considered the most promising lead-free solders for both wave and reflow soldering technology. Moreover, to improve the characteristics of lead-free solders, the effect of the addition of minor elements to lead-free solders on the properties of solder and interfacial reactions have been studied. The purpose of this research was to in...
متن کاملAlloy Oxidation and Porcelain Fused to Alloy Interaction in Noble Alloy Systems
The oxidation and porcelain fusion characteristics of noble alloys containing a variety of minor oxidizable elements, including Cu, Sn, In, Ga, Mn, and Fe were investigated. Four porcelain alloys systems: a Pd-base alloy (Naturelle}, two Pd-Ag-based alloys (Jelstar and Acclaim}, and a high Au-alloy (SMG-3) were examined by scanning electron microscopy and energy dispersive spectroscopy after be...
متن کاملذخیره در منابع من
با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید
برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید
ثبت ناماگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید
ورودعنوان ژورنال:
- Dental materials journal
دوره 22 3 شماره
صفحات -
تاریخ انتشار 2003